Clean Pad Solutions測試座清潔墊
Automated online cleaning carriers designed around package type, probe structure and test conditions.依封裝型態、探針結構與測試條件,提供可導入自動化產線的線上清潔載具。
Gold Contact Technology |金導科技
專注關鍵接觸介面,讓生產持續向前。
Since 2003, we have supported semiconductor packaging and test customers with consumables, application knowledge and responsive service.自 2003 年起,以封測耗材、應用經驗與快速服務支援全球半導體客戶。
Based in Taiwan. Serving globally. |立足台灣,服務全球
專業技術,務實合作。
Our customers support ICs used across computing, communications, consumer electronics, industrial systems and standard semiconductor products.客戶所封裝測試的 IC,廣泛應用於運算、通訊、消費電子、工業系統及各類半導體產品。
We collaborate closely—from everyday supply needs to special IC cleaning challenges.從日常耗材供應到特殊 IC 清潔需求,我們與客戶緊密合作。
Business Scope |業務範圍
從標準耗材供應,到客製化解決方案。
Automated online cleaning carriers designed around package type, probe structure and test conditions.依封裝型態、探針結構與測試條件,提供可導入自動化產線的線上清潔載具。
Kelvin and Non-Kelvin contact solutions for high-cycle semiconductor package testing.提供 Kelvin 與 Non-Kelvin 測試接觸方案,因應高次數半導體封裝測試需求。
Selected consumables and supporting materials for semiconductor assembly, packaging and test operations.供應半導體組裝、封裝與測試所需的耗材及相關材料。
Application-specific development for special packages, dimensions, materials and cleaning challenges.針對特殊封裝、尺寸、材料與清潔需求,提供客製化設計與開發。
Sales & Service Locations |銷售與服務據點
以台灣為核心,服務網絡延伸至亞洲主要半導體市場。
We are committed to providing responsive, high-quality products and services to customers across Asia.致力於為亞洲各地客戶提供高品質產品、快速回應與在地服務。

Your Application. Our Focus. |以您的應用為核心
一起打造合適的測試解決方案。
Contact our team 聯絡我們