
Clean Pad客製化清潔墊
Custom shapes, dimensions, materials and layered structures engineered around your package and test process.依封裝與測試流程,客製外型、尺寸、材料及複合層結構。
Product Catalog |產品目錄
找到適合您測試需求的產品。
A focused overview of Clean Pad, Contact Finger and customized semiconductor test consumables.快速瀏覽 Clean Pad、Contact Finger 與客製化半導體測試耗材。

Custom shapes, dimensions, materials and layered structures engineered around your package and test process.依封裝與測試流程,客製外型、尺寸、材料及複合層結構。

Package-matched dimensions and cleaning materials for automated test workflows.依封裝尺寸與自動測試流程配置適用清潔材料。

Double-sided cleaning profiles designed for vertically stacked IC packages and their upper and lower contact interfaces.針對上下堆疊式 IC 封裝設計雙面清潔結構,對應上、下接觸介面的清潔需求。

Available in Kelvin and Non-Kelvin configurations.分為 Kelvin、Non-Kelvin 兩種類型。

Designed for DIP, SOT, TO, CY and related package series.適用於 DIP、SOT、TO、CY 等系列。
Custom dimensions, materials and structures for specific test equipment and packages.依特定測試設備與封裝需求,客製尺寸、材料與結構。
Custom Solutions in Practice |客製化案例
從現場需求出發,讓耗材與零件真正適用。
Beyond standard products, we support cleaning, maintenance and functional material applications for semiconductor test operations.不只供應標準品,也依半導體測試現場需求提供清潔、維修與功能材料應用。
Cleaning Application 清潔應用
Insert the emitter pin into the Clean Tube, rotate several times, then blow away residue with an air gun. Worn sections can be trimmed for continued use.將針尖插入 Clean Tube,左右旋轉數次後以氣槍吹除殘屑;耗損處可裁切後繼續使用。


Equipment Support 設備支援
Maintenance, replacement and custom fabrication support for Guide Rails, Ledge/Test Head Rails, Input Arm telescopic rods and other wear parts.提供 Guide Rail 工字型導軌、Ledge/Test Head 軌道、Input Arm 伸縮桿及其他耗損零件的維修、替換與客製製作。






Functional Materials 功能材料
High/Low-Temperature Elastomer Profiles耐高低溫彈性矽膠條Ø0.3–1.0 mm diameters with custom profiles and dimensions.線徑 Ø0.3–1.0 mm,亦可訂製特殊截面與尺寸。
Self-Adhesive Chip Carrier Box中低黏性自吸附晶片包裝盒A low-to-medium tack surface helps retain chips during handling and storage.以中低黏性自吸附表面,協助晶片於取放與收納過程中穩定定位。




